


High-precision marking
. Small marking line width: <40um
. High marking accuracy: radial runout of pipe equipment during rotation <10um
. Good marking quality: the surface of the engraving is smooth, no obvious deformation & bumps & pits, clear boundaries, good stability
. High processing efficiency: pneumatically controlled automatic clamping & precision thin-walled tube continuous automatic feeding processing & automatic loading and unloading compatible solutions
Strong adaptability
. Equipped with a precision vision positioning system for the processing process
. Can carve various fine and complex patterns on extremely small surfaces
. Can engrave and process equal diameter pipes & deformed pipes & semi-finished pipes & flat instruments
. Can process SUS&Ni-Ti&Ti&Al&Cu&Teflon&Plastic&PTFE&Nylon and other materials
. Equipped with self-developed laser micromachining 2D&2.5D CAM software system
Flexible design
. Follow the ergonomic design concept, exquisite and simple
. Configure a machine vision system to monitor the laser dynamic processing process online in real time
. Flexible combination of software & hardware functions, supporting personalized function configuration & intelligent production management
.Support forward innovative design from component level to system level
. Open control & laser micromachining software system is easy to operate & intuitive interface
Technical parameters
| Maximum operating speed |
50mm/s (X); 50mm/s (Y); 50mm/s (Z); 500rpm (θ); |
|
Positioning accuracy |
±5um(X);±5um(Y); ±5um(Z);&# 177;25arcsec(θ); |
|
Repeat positioning accuracy |
±3um(X1);±3um(Y); ±3um(Z);&# 177;10arcsec(θ); |
|
Marking line width |
<Φ40um (generally 30um~50um); |
|
Processing material |
SUS&Ni-Ti&Ti&Al&Cu&Teflon&Plastic&PTFE&Nylon and other materials; |
|
Processing wall thickness |
0~1.0±0.02mm; |
|
Pipe processing range |
Φ0.3~Φ7.0±0.02mm&Φ1.0~Φ16.0&# 177;0.02 mm optional; |
|
Planar processing range |
300mm*300mm; |
|
Processing range |
0~300mm; |
|
Laser type |
UV laser; |
|
Laser wavelength |
355nm±10nm; |
|
Laser power |
3W&5W&10W for selection; |
|
Modulation frequency range |
30~60KHZ; |
|
Engraving line speed |
≤7000mm/s; |
|
Minimum character height |
0.2mm; |
|
Engraving depth |
0.4mm (depending on material); |
|
Power supply |
220V±10%, 50KHz; AC 15A (main circuit breaker); |
|
Compatible file formats |
DXF, DWG; |
|
Device dimensions |
1200mmx850mmx1450mm; |
|
Device weight |
800Kg; |
Sample display



